According to a new report from Korean website Financial News (via Revegnus on X/Twitter), the new chip could significantly increase the power of the Google Pixel 9.

The Pixel 9's Tensor G4, like previous Tensor chips, should be manufactured by Samsung Electronics Foundry. The difference this time around is that Tensor G4 will reportedly be manufactured on the same 4nm process as the Exynos 2400 found in the Galaxy S24 and Galaxy S24 Plus models outside the US

A big part of this apparent upgrade is the FOWLP ( fan-out wafer-level packaging). This will improve thermal management and increase chip performance and efficiency.

This may be exactly what Google needs in its next-generation flagship phones: the Tensor G3 chip in the Pixel 8 series lags far behind rivals such as the Galaxy S24 Ultra, OnePlus 12, and iPhone 15 series. The performance boost would be very helpful for the next Pixel, as it lags far behind rivals such as the Galaxy S24 Ultra, OnePlus 12, and iPhone 15 series.

Also, while we have not yet tested the Exynos-powered S24, the consensus among reviewers and users seems to be that the usual performance difference between the Exynos and Snapdragon versions of Samsung's Galaxy S phones is quite small this year.

Financial News also reports that the next Exynos chips may use 3nm chips. This is the smallest process currently offered in mobile silicon and is currently only used in the A17 Pro chip in the iPhone 15 Pro. This means that the next Tensor chip, which is expected to be used in future Galaxy S phones and possibly the Pixel 10, could be an even bigger step forward.

The Google Pixel 9 series should arrive in October of this year, if we follow Google's established release pattern. However, the Pixel 8a will likely arrive before that this summer, and perhaps the Pixel Fold 2 at some point this year.